The Research on Fabrication Process and Discharge Circuit Characteristics of Surface-Mount Micro-chip Exploding Foil Initiator
- 摘要
|
- 图/表
|
- 访问统计
|
- 参考文献
|
- 相似文献
|
- 引证文献
|
- 资源附件
|
- 文章评论
摘要:为提高爆炸箔的能量利用率、降低发火能量并缩小系统体积，本文设计并制备了一种可双面导通的贴片式微芯片爆炸箔。基于微机电技术与电镀技术，系统优化了制备工艺，并通过磁控溅射镀膜技术与电镀技术实现了贴片式爆炸箔的双面导通。将贴片微芯片爆炸箔与平面开关、陶瓷电容进行短回路集成后，利用采样电阻法对放电回路参数进行表征。结果表明，集成条件下回路电感为4.2~5.6 nH、电阻为144.3~154.7 mΩ，其电感显著低于传统长回路布局。研究表明所设计的贴片式微芯片爆炸箔能够有效降低回路电感，提升能量利用率，为爆炸箔起爆器的微型化与高性能化提供了技术支持。
Abstract:To enhance the energy utilization efficiency of exploding foil, reduce initiation energy, and achieve device miniaturization, a double-sided conductive surface-mount micro-chip exploding foil has been designed and fabricated. By leveraging micro-electromechanical systems and electrodeposition techniques, the manufacturing process was systematically optimized, and double-sided conduction was realized by magnetron sputtering technology and electroplate technology. The surface-mount micro-chip exploding foil was short-circuit integrated with a planar switch and ceramic capacitor, and its discharge circuit parameters were characterized using the sampling resistance method. The results show that under integrated conditions, the circuit inductance is 4.2~5.6 nH and the resistance is 144.3~154.7 mΩ, both significantly lower than those of traditional long-circuit layouts. The study indicates that the designed surface-mount micro-chip exploding foil can effectively reduce circuit inductance and improve energy utilization efficiency, offering technical support for the miniaturization and high-performance of exploding foil initiators.
var swiper = new Swiper('.swiper_xq', {
navigation: {
nextEl: '.swiper-button-next',
prevEl: '.swiper-button-prev',
},
});
$(function(){
$('img').bigic();
});
jQuery(".slideTxtBox").slide({ trigger: "click" });
