EHTPB/HMDI粘合体系催化剂的选择 与固化反应动力学
Selection of Catalysts and Curing Kinetics of EHTPB/HMDI Binder System
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摘要:通过粘度测试考察了环氧化端羟基聚丁二烯（EHTPB）/4,4'-二环己基甲烷二异氰酸酯（HMDI）粘合体系分别在4种催化剂作用下的固化反应速率，运用非等温DSC法研究了EHTPB/HMDI/T9体系的固化反应动力学，利用外推法预测了升温速率为0时的特征固化温度。结果表明：不同催化剂使粘合体系固化速率差异显著，最佳催化剂为辛酸亚锡（T9）。由Kissinger、Flynn-Wall-Ozawa及Doyle法计算得到EHTPB/HMDI/T9体系固化反应活化能分别为52.80 kJ/mol、56.99 kJ/mol及59.93 kJ/mol，由Crane法得到反应级数n=0.944，并进一步求得热力学参数ΔH＝54.74 kJ/mol，ΔG＝132.60 kJ/mol。该体系固化反应峰始温度171.35 ℃，峰顶温度181.25℃，峰止温度199.70℃，为最佳固化条件的确定提供了一定的技术参考。
Abstract:The curing reaction rate of EHTPB/HDMI binder system was investigated by viscosity test with FeAA, T12, T9 and TPB as catalyst respectively. The curing kinetics of EHTPB/HDMI/T9 system was studied by non-isothermal DSC. The characteristic curing temperature of EHTPB/HDMI/T9 system was predicted by extrapolation method with a heating rate of 0℃/min. The results show that the curing rate of the binder system is significantly different with different catalysts, and the best catalytic effect is T9. The activation energies of curing reaction of EHTPB/HMDI/T9 system calculated by Kissinger, Flynn-Wall-Ozawa and Doyle methods are respectively 52.80 kJ/mol, 56.99 kJ/mol and 59.93 kJ/mol. The reaction order obtained by Crane method is 0.944, the thermodynamic parameter ΔH is 54.74 kJ/mol and ΔG is 132.60 kJ/mol. The initial temperature of the curing reaction is at 171.35℃, the peak temperature is at 181.25℃, and the stopping temperature is at 199.70℃, which provides a certain technical reference for the optimal curing conditions.
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