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基于电热特性分析的微桥膜设计
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TJ450.2

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Design of Micro-bridge Membrane Based on Electrothermal Analysis
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    摘要:

    为实现MEMS技术加工的微桥膜低能化,设计不同结构和材料的桥膜,仿真研究桥膜电流密度、温度的变化过程;通过研究方形桥区对角线的电热特性曲线,以解决电流与H型微桥膜材料的匹配问题。结果表明:微桥膜两端输入电流为500A时,H型桥膜桥区温度分布最均匀;相比铜微桥膜,金桥膜达到熔点所需的时间短,但是平均升温速率低;铜微桥膜的熔化面积大、分布更均匀。在300~700A输入电流范围内,对于铜、金、铝H型微桥膜,输入电流依次为500A、450A、400A时起爆可以提高它们的能量利用率。

    Abstract:

    To realize the miniaturized micro-bridge films processed by MEMS technology with low energy initiation, the miniaturized micro-bridge films with different structures and materials were designed, the current density and temperature change process were studied by simulation. By studying the electrothermal characteristic curve of the diagonal of square bridge area, the matching problem of current and material of H-shaped micro-bridge membrane was solved. The results show that the temperature distribution of H-shaped bridge is the most uniform when the input current at both ends of the micro-bridge is 500A. Compared to copper bridge film, it takes less time to reach the melting point for gold bridge film, while its average heating rate is lower. The melting area of copper micro-bridge film is larger and the distribution is more uniform. In the input current range from 300A to 700A, the initiation of copper, gold and aluminum micro-bridge films with the current of 500A, 450A and 400A can improve their energy utilization rate.

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  • 在线发布日期: 2021-12-15
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